EP2SGX90EF1152C3ES vs EP2SGX90EF1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90EF1152C3ES sa pamamagitan ng Intel at EP2SGX90EF1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ Huling PagbiliIntel
EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
EP2SGX90EF1152C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix II GX | Stratix II GX |
| Process Node | 90 nm | — |
| Logic Elements | 90,960 | — |
| Embedded Memory | 4,520,448 bits (approx. 4.5 Mbit) | — |
| User I/O Pins | 558 | — |
| Packhaging | 1152-BBGA (FineLine BGA, 35x35 mm) | — |
| Speed Grade | C3 | EF |
| Temperature Grade | Commercial Extended (-40 C to +100 C) | C3 (Commercial) |
| Core Voltage | 1.5 V (Enhanced, 'E' suffix) | 1.2 V |
| High-Speed Transceivers | Up to 12 channels (per Stratix II GX family) | — |
| Transceiver Data Rate | Up to 6.375 Gbps per channel (family spec) | — |
| DSP Blocks | Yes, dedicated 18x18 multipliers and accumulators | — |
| PLL Count | [DATA_NEEDED: PLL count for EP2SGX90 variant] | — |
| User I/O Banks | 24 (per package datasheet) | — |
| Configuration | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Process Technology | — | 90 nm |
| Operating Frequency (max) | — | 816.9 MHz |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |