EP2SGX90EF1152C3N vs EP2SGX90EF1152C5ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3N disebabkan oleh Intel dan EP2SGX90EF1152C5ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
EP2SGX90EF1152C5ES ObsoletePengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C3N | EP2SGX90EF1152C5ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | 558 |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | 12 (up to 20 channels) |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Operating Frequency (max) | 816.9 MHz | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Jenis Pemasangan | Surface Mount | — |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C5 (commercial, mid-tier) |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Embedded Memory (bits) | — | 4,520,448 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Kemasan | — | 1152-FBGA (FineLine BGA) |
| Configuration Method | — | Fast passive parallel, active serial, JTAG |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |