EP2SGX90EF1152I3 vs EP2SGX90EF1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152I3 disebabkan oleh Intel dan EP2SGX90EF1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX90EF1152I3 EP2SGX90EF1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Series Stratix II GX Stratix II GX
Logic Elements 90,960 —
Adaptive Logic Modules (ALMs) 558 —
Equivalent Logic Cells (CLBs) 90,960 —
Total RAM Bits 4,520,448 —
Maximum Operating Frequency 622.08 MHz —
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage (VCCINT) 1.2 V nominal (1.15 V to 1.25 V) —
Operating Temperature Grade Industrial (-40C to +100C) —
Package Type 1152-ball FC-FBGA (flip-chip) FC-FBGA (Flip-Chip Fine-pitch BGA)
Terminal Form Ball —
Terminal Pitch [DATA_NEEDED: ball pitch] —
Package Code BGA —
Package Shape Square —
Configuration Architecture Enhanced Configuration (EPC) devices supported —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant —
Family — Stratix II GX
Logic Elements (LE) — 90960
Number of LABs/CLBs — 4548
Total Memory Bits — 4520448
User I/Os — 558
Number of Transceivers — [DATA_NEEDED: transceiver count per family]
Core Voltage — 1.2 V
Operating Frequency (max) — 816.9 MHz
Suhu Operasi — 0C to +85C (Commercial)
Package Pin Count — 1152 balls
Package Dimensions — 34 mm x 34 mm
Lead-Free / RoHS — Yes (RoHS compliant)
Speed Grade — EF
Temperature Grade — C3 (Commercial)

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