EP2SGX90FE1152C3 vs EP2SGX90EF1152I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90FE1152C3 disebabkan oleh Intel dan EP2SGX90EF1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 ⚠ Bahagian terakhir untuk beliIntel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX90FE1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Number of LABs / CLBs | 4,548 | — |
| Number of Logic Elements / Cells | 90,960 | — |
| Number of I/O | 558 | — |
| Number of Gates | [DATA_NEEDED: gates count] | — |
| Voltage - Supply | 1.2 V core | — |
| Suhu Operasi | 0C to +85C (commercial, C3 suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Kemasan / Case | 1152-BBGA / FC-FBGA | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Number of Transceiver Channels | 12 | — |
| DSP Blocks (18x18 multipliers) | 192 | — |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Tingkat sensitiviti Air Nama (MSL) | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |