EP2SGX90FF1508C3ES vs EP2SGX130GF1508C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90FF1508C3ES disebabkan oleh Intel dan EP2SGX130GF1508C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete
Pengandingan Spesifikasi
| Parametr | EP2SGX90FF1508C3ES | EP2SGX130GF1508C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| Logic Array Blocks (LABs) | 4,828 | 6,627 |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | 717 MHz |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| Kemasan | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | Commercial (C3 speed grade) |
| Status RoHS | [DATA_NEEDED: rohs] | Contains lead / RoHS non-compliant |
| Total Memory Bits | — | 6,748,860 |
| Maximum User I/O | — | 734 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.2 V |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |