EP2SGX90FF1508C3ES vs EP2SGX130GF1508C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3ES sa pamamagitan ng Intel at EP2SGX130GF1508C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete
Pagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C3ES | EP2SGX130GF1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| Logic Array Blocks (LABs) | 4,828 | 6,627 |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | 717 MHz |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| Packhaging | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | Commercial (C3 speed grade) |
| Tindminan RoHS | [DATA_NEEDED: rohs] | Contains lead / RoHS non-compliant |
| Total Memory Bits | — | 6,748,860 |
| Maximum User I/O | — | 734 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.2 V |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |