EP3C55F780C7N vs EP3C55F780I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F780C7N disebabkan oleh Intel dan EP3C55F780I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55F780C7N | EP3C55F780I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | Low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Suhu Operasi | 0C to +85C (commercial, C7 speed grade) | — |
| Kemasan | 780-ball FineLine BGA | 780-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Speed Grade | 7 | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory (M9K blocks) | — | 234 Kbits total |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 377 |
| Core Supply Voltage | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Jenis Pemasangan | — | Surface Mount |
| Operating Temperature (Industrial) | — | -40C to +100C |
| Configuration Method | — | JTAG / Active Serial / Passive Serial / Fast Passive Parallel |