EP3C55F780C7N vs EP3C55F780I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C7N sa pamamagitan ng Intel at EP3C55F780I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C7N | EP3C55F780I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | Low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Temperature na Operasyon | 0C to +85C (commercial, C7 speed grade) | — |
| Packhaging | 780-ball FineLine BGA | 780-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Speed Grade | 7 | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory (M9K blocks) | — | 234 Kbits total |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 377 |
| Core Supply Voltage | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Uri ng Pagpapasok | — | Surface Mount |
| Operating Temperature (Industrial) | — | -40C to +100C |
| Configuration Method | — | JTAG / Active Serial / Passive Serial / Fast Passive Parallel |