EP3C5F256C8N vs EP3C5F256C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C8N disebabkan oleh Intel dan EP3C5F256C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C8N | EP3C5F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/Os | 182 | — |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Suhu Operasi | 0C to 85C (Commercial) | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Process Technology | 65 nm | 65 nm CMOS, low-k |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Lead Free (per Altera/Intel product page) | Compliant (lead-free per FBGA package) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | — | 423,936 bits |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |