EP3C5F256C8N vs EP3C5F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C8N disebabkan oleh Intel dan EP3C5F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C8N | EP3C5F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | — |
| Suhu Operasi | 0C to 85C (Commercial) | -40C to +125C (Industrial) |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| Process Technology | 65 nm | TSMC 65nm low-power |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Lead Free (per Altera/Intel product page) | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone III |
| Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 26 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Aras MSL | — | 3 (168 hours) |