EP3C5F256I7N vs EP3C5F256C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256I7N disebabkan oleh Intel dan EP3C5F256C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256I7N | EP3C5F256C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | 23 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | — |
| Kemasan | 256-FBGA (FineLine BGA) | 256-LBGA (FineLine BGA, 17x17 mm) |
| Suhu Operasi | -40C to +125C (Industrial) | 0C to +85C (commercial, per 'C' speed bin) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm low-power CMOS |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | JTAG, AS, AP, PS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Aras MSL | 3 (168 hours) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 182 |
| Total Embedded Memory | — | 423,936 bits (414 Kbit) |
| M9K Memory Blocks | — | 46 |
| User I/Os | — | 182 |
| User I/O Banks | — | 8 |
| Speed Grade | — | -7 (commercial, slowest C-tier) |
| Core Voltage | — | 1.2 V (nominal) |
| Lead-Free / Pb-Free | — | Yes (suffix 'N' denotes lead-free) |