EP3C5U256A7N vs EP3C5U256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5U256A7N disebabkan oleh Intel dan EP3C5U256C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5U256A7N | EP3C5U256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 5,136 LE | 5,136 |
| Embedded Memory | 414 kbit (423,936 bits) | 423,936 bits |
| Number of I/Os | 182 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Gaya Pemasangan | SMD/SMT | — |
| Kemasan / Case | BGA-256 (U256 Ultra FineLine) | — |
| Packaging | Tray | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive grade) | — |
| Temperature Grade | Automotive | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | -7 | C6 |
| Status RoHS | Compliant | — |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Maximum User I/Os | — | 182 |
| Kemasan | — | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Process Technology | — | 60 nm low-power CMOS |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead Free / RoHS | — | Yes / Compliant |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |