EP3C5U256A7N vs EP3C5U256C6N 比較
詳細並排比較 EP3C5U256A7N 由 Intel 與 EP3C5U256C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C5U256A7N | EP3C5U256C6N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 5,136 LE | 5,136 |
| Embedded Memory | 414 kbit (423,936 bits) | 423,936 bits |
| Number of I/Os | 182 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| 安裝方式 | SMD/SMT | — |
| 封裝 / 外殼 | BGA-256 (U256 Ultra FineLine) | — |
| Packaging | Tray | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive grade) | — |
| Temperature Grade | Automotive | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | -7 | C6 |
| RoHS 狀態 | Compliant | — |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Maximum User I/Os | — | 182 |
| 封裝 | — | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Process Technology | — | 60 nm low-power CMOS |
| 安裝類型 | — | Surface Mount (BGA) |
| Lead Free / RoHS | — | Yes / Compliant |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |