EP3CLS100F484C8N vs EP3C55F484C8N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS100F484C8N disebabkan oleh Intel dan EP3C55F484C8N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS100F484C8N EP3C55F484C8N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone® III LS —
Family Name Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits 2,396,160
Number of I/O 278 (maximum user I/O) —
Number of Logic Blocks / Cells 47 (logic blocks reported by DigChip snapshot) —
Package Type FBGA-484 (FineLine BGA, lead-free) —
Pin / Ball Count 484 —
Supply Voltage (Core) 1.2 V —
Speed Grade C8 (commercial, fastest) —
Process Technology TSMC 65 nm low-power (LP) —
Suhu Operasi 0°C to +85°C (commercial grade) —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Configuration Interface JTAG, Passive Serial, Active Serial —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
Status RoHS Compliant (Pb-free, 'N' suffix) —
Aras MSL 3 (per JEDEC J-STD-020, typical for BGA) —
Embedded Multipliers (18x18) 4,488 (per Cyclone III LS family handbook, 100K LE tier) 260
PLLs 4 (per Cyclone III LS family) 4
DSP Blocks Integrated (multiplier-based) —
Device Family — Cyclone III
Logic Elements (LE) — 55,856
User I/O Pins — 327
Memory Blocks (M9K) — 260
Maximum Internal Frequency — 472 MHz
Core Voltage (VCCINT) — 1.2 V
Kemasan — 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch
Package Height — 2.60 mm
Operating Temperature (Commercial) — 0 C to +85 C
Process Node — 65 nm TSMC low-power
Configuration — SRAM-based, JTAG / AS / PS modes
Lead-Free / RoHS — Yes - lead-free, RoHS compliant

Laporan Datasheet & Sumber

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