EP3CLS100F484C8N vs EP3C55F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F484C8N sa pamamagitan ng Intel at EP3C55F484C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
EP3C55F484C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS100F484C8N | EP3C55F484C8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | 2,396,160 |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | — |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Temperature na Operasyon | 0°C to +85°C (commercial grade) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Tindminan RoHS | Compliant (Pb-free, 'N' suffix) | — |
| Level ng MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 260 |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| User I/O Pins | — | 327 |
| Memory Blocks (M9K) | — | 260 |
| Maximum Internal Frequency | — | 472 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Packhaging | — | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Package Height | — | 2.60 mm |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Process Node | — | 65 nm TSMC low-power |
| Configuration | — | SRAM-based, JTAG / AS / PS modes |
| Lead-Free / RoHS | — | Yes - lead-free, RoHS compliant |