EP3CLS100F484C8N vs EP3C55F484C8N 比較

詳細並排比較 EP3CLS100F484C8N 由 Intel 與 EP3C55F484C8N 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS100F484C8N EP3C55F484C8N
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Cyclone® III LS —
Family Name Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits 2,396,160
Number of I/O 278 (maximum user I/O) —
Number of Logic Blocks / Cells 47 (logic blocks reported by DigChip snapshot) —
Package Type FBGA-484 (FineLine BGA, lead-free) —
Pin / Ball Count 484 —
Supply Voltage (Core) 1.2 V —
Speed Grade C8 (commercial, fastest) —
Process Technology TSMC 65 nm low-power (LP) —
工作溫度 0°C to +85°C (commercial grade) —
安裝類型 Surface Mount Surface Mount (BGA)
Configuration Interface JTAG, Passive Serial, Active Serial —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
RoHS 狀態 Compliant (Pb-free, 'N' suffix) —
MSL 等級 3 (per JEDEC J-STD-020, typical for BGA) —
Embedded Multipliers (18x18) 4,488 (per Cyclone III LS family handbook, 100K LE tier) 260
PLLs 4 (per Cyclone III LS family) 4
DSP Blocks Integrated (multiplier-based) —
Device Family — Cyclone III
Logic Elements (LE) — 55,856
User I/O Pins — 327
Memory Blocks (M9K) — 260
Maximum Internal Frequency — 472 MHz
Core Voltage (VCCINT) — 1.2 V
封裝 — 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch
Package Height — 2.60 mm
Operating Temperature (Commercial) — 0 C to +85 C
Process Node — 65 nm TSMC low-power
Configuration — SRAM-based, JTAG / AS / PS modes
Lead-Free / RoHS — Yes - lead-free, RoHS compliant

資料表與資源

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