EP3CLS100F780I7 vs EP3CLS100F780C8N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS100F780I7 disebabkan oleh Intel dan EP3CLS100F780C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS100F780I7 EP3CLS100F780C8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Family Cyclone III LS Cyclone III LS
Device Type FPGA (Field Programmable Gate Array) —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits (~4.4 Mbit) —
Number of Logic Array Blocks 47 (per distributor summary) —
Number of Transceivers 4 —
Maximum User I/O 413 429
Kemasan 780-ball FBGA (F780) 780-ball FBGA (FineLine BGA)
Supply Voltage (Core) 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
Process Technology 60 nm low-power CMOS 65 nm low-power CMOS
Configuration Method SRAM-based, JTAG or external flash (EPCS/EPCQ) —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL —
PLLs Up to 8 (family maximum) —
Security Features 256-bit AES bitstream encryption, JTAG disable —
Status RoHS Compliant Compliant
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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