EP3CLS100F780I7 vs EP3CLS100F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F780I7 sa pamamagitan ng Intel at EP3CLS100F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS100F780I7 EP3CLS100F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone III LS Cyclone III LS
Device Type FPGA (Field Programmable Gate Array) —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits (~4.4 Mbit) —
Number of Logic Array Blocks 47 (per distributor summary) —
Number of Transceivers 4 —
Maximum User I/O 413 429
Packhaging 780-ball FBGA (F780) 780-ball FBGA (FineLine BGA)
Supply Voltage (Core) 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
Process Technology 60 nm low-power CMOS 65 nm low-power CMOS
Configuration Method SRAM-based, JTAG or external flash (EPCS/EPCQ) —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL —
PLLs Up to 8 (family maximum) —
Security Features 256-bit AES bitstream encryption, JTAG disable —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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