EP3CLS150F484C7 vs EP3C55F484C8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS150F484C7 disebabkan oleh Intel dan EP3C55F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS150F484C7 EP3C55F484C8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III LS —
Logic Elements (LE) 149,760 —
Total Memory Bits 6,138,560 —
Embedded Multipliers (18x18) 396 —
User I/O Count 210 —
Configuration Logic Blocks (CLBs) 150,848 —
PLLs 4 4
Maximum User I/O Pins 210 —
Kemasan 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height
Process Technology 60 nm TSMC low-power CMOS 65 nm low-power CMOS
Supply Voltage Core (VCCINT) 1.2 V —
Supply Voltage Auxiliary (VCCAUX) 2.5 V —
Operating Temperature (Commercial) 0C to +85C —
Status RoHS Compliant —
Jenis Pemasangan Surface Mount —
AES Bitstream Encryption AES-256 with 64-bit volatile key —
Device Family — Cyclone® III
Logic Elements (LEs) — 55,856
Logic Array Blocks (LABs) — 3,491
Embedded Memory Bits — 2,396,160 bits
Embedded 18x18 Multipliers — 312
User I/Os — 327
Global Clock Networks — 20
Maximum Core Frequency — 472.5 MHz
Speed Grade — C8 (commercial, -8)
Suhu Operasi — Commercial (0C to +85C)
Configuration Modes — JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
Lead-Free / RoHS — Yes (Pb-free FBGA)
Tegangan Pemberi Arus — Core 1.2 V typical, I/O bank dependent
I/O Standards Supported — LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others

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