EP3CLS150F484C7N vs EP3CLS200F484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS150F484C7N disebabkan oleh Intel dan EP3CLS200F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS150F484C7N | EP3CLS200F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 150,848 | 198,464 |
| Logic Array Blocks (LAB) | 9,428 | 12,404 |
| Total Memory Bits | 6,137,856 | — |
| DSP Blocks | 210 | — |
| Maximum User I/O | 226 | — |
| Operating Temperature Grade | C (0 °C to 85 °C) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437.5 MHz | — |
| PLLs | 4 | 4 |
| Kemasan | 484-pin FBGA (1.0 mm pitch) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Bitstream Encryption | AES-128 supported | — |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| Status RoHS | — | Compliant |