EP3CLS150F484C7N vs EP3CLS200F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS150F484C7N sa pamamagitan ng Intel at EP3CLS200F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS150F484C7N | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 150,848 | 198,464 |
| Logic Array Blocks (LAB) | 9,428 | 12,404 |
| Total Memory Bits | 6,137,856 | — |
| DSP Blocks | 210 | — |
| Maximum User I/O | 226 | — |
| Operating Temperature Grade | C (0 °C to 85 °C) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437.5 MHz | — |
| PLLs | 4 | 4 |
| Packhaging | 484-pin FBGA (1.0 mm pitch) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Bitstream Encryption | AES-128 supported | — |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| Tindminan RoHS | — | Compliant |