EP3CLS200F484C7N vs EP3CLS200F484C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C7N disebabkan oleh Intel dan EP3CLS200F484C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C7N | EP3CLS200F484C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Kemasan | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Technology | 65 nm low-power CMOS | CMOS, low-power |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | 4 |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone III LS |
| Logic Array Blocks (LABs) | — | 12,408 |
| Embedded Memory (RAM bits) | — | 8,211,456 |
| Maximum User I/Os | — | 226 |
| DSP Blocks | — | 396 (18x18 multipliers) |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| I/O Supply Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |