EP3CLS200F780I7 vs EP3CLS200F780C8ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F780I7 disebabkan oleh Intel dan EP3CLS200F780C8ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F780I7 | EP3CLS200F780C8ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Cyclone III LS | Cyclone III LS |
| Device Family | Cyclone III LS | — |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,040 LAB | 12,404 |
| Total Memory Bits | 8,475 Kbits | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| User I/O Pins | 429 | — |
| PLLs | 4 | 4 |
| Maximum Operating Frequency | 274 MHz | — |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Kemasan | 780-BGA (FBGA) | 780-ball FBGA (FineLine BGA) |
| Package Pins | 780 | — |
| Jenis Pemasangan | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Suhu Operasi | -40 C to +85 C (Industrial) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Moisture Sensitivity Level | MSL 3 | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (bits) | — | 8,211,456 |
| Maximum User I/O | — | 413 |
| Process Technology | — | 65 nm CMOS (low-power) |
| Suhu Hubungan Operasi | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| Speed Grade | — | 8 |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |