EP3CLS200F780I7 vs EP3CLS200F780C8ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F780I7 sa pamamagitan ng Intel at EP3CLS200F780C8ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F780I7 | EP3CLS200F780C8ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Series | Cyclone III LS | Cyclone III LS |
| Device Family | Cyclone III LS | — |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,040 LAB | 12,404 |
| Total Memory Bits | 8,475 Kbits | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| User I/O Pins | 429 | — |
| PLLs | 4 | 4 |
| Maximum Operating Frequency | 274 MHz | — |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Packhaging | 780-BGA (FBGA) | 780-ball FBGA (FineLine BGA) |
| Package Pins | 780 | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Temperature na Operasyon | -40 C to +85 C (Industrial) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Moisture Sensitivity Level | MSL 3 | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (bits) | — | 8,211,456 |
| Maximum User I/O | — | 413 |
| Process Technology | — | 65 nm CMOS (low-power) |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| Speed Grade | — | 8 |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |