EP3SE110F1152I4L vs EP3SE110F1152C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152I4L disebabkan oleh Intel dan EP3SE110F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE110F1152I4L EP3SE110F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix III E —
Logic Elements 107,500 107,500
Embedded Memory Bits 8,936,448 bits —
User I/O Count 744 —
Number of LABs/CLBs 4300 —
DSP Multipliers 528 (9-bit equivalent) —
Kemasan 1152-BBGA, FCBGA —
Jenis Pemasangan Surface Mount —
Suhu Operasi -40C to +100C (Industrial) —
Speed Grade I4 (fastest industrial grade) —
Process Technology 40 nm 65 nm
Supply Voltage (Core) [DATA_NEEDED: nominal core voltage] —
Aras MSL 3 (168 Hours) —
Packaging Tray —
Status RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Family — Stratix III E
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

Laporan Datasheet & Sumber

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