EP3SE110F780C3N vs EP3SE110F780C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C3N disebabkan oleh Intel dan EP3SE110F780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE110F780C3N EP3SE110F780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Family Stratix III E Stratix III
Logic Elements (LEs) 107,500 107500
Embedded Memory Bits 8,936,448 8936448
Logic Array Blocks (LABs) 4,300 —
User I/Os 488 —
Kemasan 780-ball FCBGA (Flip-Chip BGA) —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Operating Frequency 500 MHz —
DSP Blocks Yes (integrated, count varies by configuration) —
Transceiver Channels 8 (multi-gigabit) —
Embedded Memory TriMatrix (MLAB + M9K + M144K) —
Configuration Method Serial / Parallel via Quartus II —
Operating Temperature Grade Commercial (C suffix) —
Status RoHS Compliant Compliant
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL [DATA_NEEDED: MSL rating] —
Series — Stratix III E
User I/O Count — 488
Number of Terminals — 780
Package Type — 780-BBGA, FCBGA
Package Code — BGA
Terminal Form — Ball
Package Shape — Square
Speed Grade — C4
Suhu Operasi — 0C to 85C (Commercial)
Process Node — 65 nm
Configuration Mode — PS / FPP / JTAG

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