EP3SE110F780C3N vs EP3SE110F780C4N 比較

詳細並排比較 EP3SE110F780C3N 由 Intel 與 EP3SE110F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE110F780C3N EP3SE110F780C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Family Stratix III E Stratix III
Logic Elements (LEs) 107,500 107500
Embedded Memory Bits 8,936,448 8936448
Logic Array Blocks (LABs) 4,300 —
User I/Os 488 —
封裝 780-ball FCBGA (Flip-Chip BGA) —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Operating Frequency 500 MHz —
DSP Blocks Yes (integrated, count varies by configuration) —
Transceiver Channels 8 (multi-gigabit) —
Embedded Memory TriMatrix (MLAB + M9K + M144K) —
Configuration Method Serial / Parallel via Quartus II —
Operating Temperature Grade Commercial (C suffix) —
RoHS 狀態 Compliant Compliant
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL rating] —
Series — Stratix III E
User I/O Count — 488
Number of Terminals — 780
Package Type — 780-BBGA, FCBGA
Package Code — BGA
Terminal Form — Ball
Package Shape — Square
Speed Grade — C4
工作溫度 — 0C to 85C (Commercial)
Process Node — 65 nm
Configuration Mode — PS / FPP / JTAG

資料表與資源

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