EP3SE110F780C4LN vs EP3SE110F780C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C4LN disebabkan oleh Intel dan EP3SE110F780C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C4LN | EP3SE110F780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | 8,936,448 bits (8.9 Mbit) |
| User I/O Pins | 488 | — |
| Kemasan | 780-BBGA, FCBGA (Fine-pitch) | 780-ball FCBGA (FineLine BGA) |
| Supply Voltage Core | 0.9 V (typical) | — |
| Suhu Operasi | 0C to +85C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | C4 | C4 |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Jenis Pemasangan | Surface Mount (SMT) | Surface Mount |
| Process Technology | 40 nm TSMC | — |
| DSP Blocks | Yes (18x18 multipliers) | — |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Tray Packaging | Yes (per distributor listings) | — |
| Logic Elements | — | 107,500 |
| DSP Blocks (18x18 Multipliers) | — | 896 |
| Maximum User I/O | — | 488 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | Up to 1.6 Gbps |
| Memory Interface Support | — | DDR3 up to 800 MHz |
| Status RoHS | — | Compliant |
| Configuration | — | Partial Reconfiguration support |