EP3SE110F780C4LN vs EP3SE110F780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C4LN sa pamamagitan ng Intel at EP3SE110F780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780C4LN | EP3SE110F780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | 8,936,448 bits (8.9 Mbit) |
| User I/O Pins | 488 | — |
| Packhaging | 780-BBGA, FCBGA (Fine-pitch) | 780-ball FCBGA (FineLine BGA) |
| Supply Voltage Core | 0.9 V (typical) | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | Commercial (0C to +85C) |
| Speed Grade | C4 | C4 |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (SMT) | Surface Mount |
| Process Technology | 40 nm TSMC | — |
| DSP Blocks | Yes (18x18 multipliers) | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tray Packaging | Yes (per distributor listings) | — |
| Logic Elements | — | 107,500 |
| DSP Blocks (18x18 Multipliers) | — | 896 |
| Maximum User I/O | — | 488 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | Up to 1.6 Gbps |
| Memory Interface Support | — | DDR3 up to 800 MHz |
| Tindminan RoHS | — | Compliant |
| Configuration | — | Partial Reconfiguration support |