EP3SE110F780I4N vs EP3SE260H780I4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780I4N disebabkan oleh Intel dan EP3SE260H780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE110F780I4N EP3SE260H780I4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Manufacturer Intel (formerly Altera) —
Series Stratix III E —
Logic Elements 107,500 255,000
Embedded Memory Bits 8,936,448 bits 16,672,768 bits
Number of LABs/CLBs 4300 —
Number of Logic Elements / Cells 107500 —
Number of I/O 488 —
Kemasan 780-ball FCBGA (FineLine BGA) 780-pin FC-HFBGA (FCBGA)
Package Code (JEDEC) BGA, 780 pins —
Jenis Pemasangan Surface Mount —
Suhu Operasi -40C to +100C (industrial) -40C to +100C (Industrial)
Speed Grade 4 —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal] —
Process Node 40 nm —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Lead Free [DATA_NEEDED: lead-free status] —
Family — Stratix III Enhanced (Stratix III E)
Logic Array Blocks (LABs) — 10,200
User I/Os — 488
Process Technology — 65 nm
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

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