EP3SE110F780I4N vs EP3SE260H780I4N 比較

詳細並排比較 EP3SE110F780I4N 由 Intel 與 EP3SE260H780I4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ 最後購買機會

規格比較

參數 EP3SE110F780I4N EP3SE260H780I4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Manufacturer Intel (formerly Altera) —
Series Stratix III E —
Logic Elements 107,500 255,000
Embedded Memory Bits 8,936,448 bits 16,672,768 bits
Number of LABs/CLBs 4300 —
Number of Logic Elements / Cells 107500 —
Number of I/O 488 —
封裝 780-ball FCBGA (FineLine BGA) 780-pin FC-HFBGA (FCBGA)
Package Code (JEDEC) BGA, 780 pins —
安裝類型 Surface Mount —
工作溫度 -40C to +100C (industrial) -40C to +100C (Industrial)
Speed Grade 4 —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal] —
Process Node 40 nm —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Lead Free [DATA_NEEDED: lead-free status] —
Family — Stratix III Enhanced (Stratix III E)
Logic Array Blocks (LABs) — 10,200
User I/Os — 488
Process Technology — 65 nm
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

資料表與資源

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