EP3SE260F1152C2N vs EP3SE260F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C2N disebabkan oleh Intel dan EP3SE260F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152C2N EP3SE260F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array —
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi [DATA_NEEDED: operating temperature grade] 0 C to +85 C (Commercial)
Kemasan / Case 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
Kemasan — 1152-BBGA, FCBGA
Core Voltage — 1.1 V
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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