EP3SE260F1152C2N vs EP3SE260F1152C3N 比較

詳細並排比較 EP3SE260F1152C2N 由 Intel 與 EP3SE260F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1152C2N EP3SE260F1152C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array —
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: operating temperature grade] 0 C to +85 C (Commercial)
封裝 / 外殼 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
封裝 — 1152-BBGA, FCBGA
Core Voltage — 1.1 V
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

資料表與資源

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