EP3SE260F1152C3 vs EP3SE260F1152C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C3 disebabkan oleh Intel dan EP3SE260F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1152C3 EP3SE260F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Series Stratix III E Stratix III E (Enhanced)
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 744 —
Embedded 18x18 Multipliers 384 —
Kemasan 1152-ball FCBGA (Flip-Chip BGA) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Core Voltage 0.9 V to 1.1 V 1.1 V
Process Technology 40 nm 65 nm CMOS (TSMC)
Suhu Operasi 0C to +85C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Configuration Method Passive Serial / Fast Passive Parallel / JTAG —
PLLs 12 —
Status RoHS Compliant Compliant (per distributor listings)
Speed Grade C3 C4 (slowest commercial grade)
Family — Stratix III
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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