EP3SE260F1152C3 vs EP3SE260F1152C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3 sa pamamagitan ng Intel at EP3SE260F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3 EP3SE260F1152C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Series Stratix III E Stratix III E (Enhanced)
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 744 —
Embedded 18x18 Multipliers 384 —
Packhaging 1152-ball FCBGA (Flip-Chip BGA) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Core Voltage 0.9 V to 1.1 V 1.1 V
Process Technology 40 nm 65 nm CMOS (TSMC)
Temperature na Operasyon 0C to +85C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Configuration Method Passive Serial / Fast Passive Parallel / JTAG —
PLLs 12 —
Tindminan RoHS Compliant Compliant (per distributor listings)
Speed Grade C3 C4 (slowest commercial grade)
Family — Stratix III
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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