EP3SE260F1152C3N vs EP3SE260F1152C2N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C3N disebabkan oleh Intel dan EP3SE260F1152C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260F1152C3N EP3SE260F1152C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Series Stratix III E Stratix III E
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 —
Kemasan 1152-BBGA, FCBGA —
Jenis Pemasangan Surface Mount Surface Mount
Process Technology 65 nm 65 nm
Core Voltage 1.1 V —
Suhu Operasi 0 C to +85 C (Commercial) [DATA_NEEDED: operating temperature grade]
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Status RoHS Compliant Compliant
Family — FPGA - Field Programmable Gate Array
Number of Logic Elements — 255000
Number of LABs/CLBs — 10200
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Kemasan / Case — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
Aras MSL — [DATA_NEEDED: MSL rating]
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

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