EP3SE260F1152C4L vs EP3SE260F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4L disebabkan oleh Intel dan EP3SE260F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260F1152C4L EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1152C4L EP3SE260F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Stratix III E —
Logic Elements (LE) 255,000 —
Adaptive Logic Modules (ALMs) 10,200 —
Total Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/O Pins 744 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 1.1 V
Kemasan 1152-ball FC-FBGA 1152-BBGA, FCBGA
Suhu Operasi 0C to +85C (Commercial) 0 C to +85 C (Commercial)
Maximum Frequency 375 MHz —
Transceivers Integrated high-speed transceivers Integrated high-speed transceivers
Memory Interfaces DDR2/DDR3 with hard controllers —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG AS, AP, PS, FPP, JTAG
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Status RoHS Compliant Compliant
Series — Stratix III E
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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