EP3SE260F1152C4L vs EP3SE260F1152C3N 比較
詳細並排比較 EP3SE260F1152C4L 由 Intel 與 EP3SE260F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ 啟用中規格比較
| 參數 | EP3SE260F1152C4L | EP3SE260F1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALMs) | 10,200 | — |
| Total Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/O Pins | 744 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| 封裝 | 1152-ball FC-FBGA | 1152-BBGA, FCBGA |
| 工作溫度 | 0C to +85C (Commercial) | 0 C to +85 C (Commercial) |
| Maximum Frequency | 375 MHz | — |
| Transceivers | Integrated high-speed transceivers | Integrated high-speed transceivers |
| Memory Interfaces | DDR2/DDR3 with hard controllers | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | AS, AP, PS, FPP, JTAG |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 744 |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |