EP3SE260F1152C4N vs EP3SE260F1152C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4N disebabkan oleh Intel dan EP3SE260F1152C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152C4N | EP3SE260F1152C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III (Enhanced) | — |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 40 nm |
| Core Voltage | 1.1 V | 0.9 V to 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| Kemasan | 1152-ball FC-FBGA (flip-chip) | 1152-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | -4 (commercial temperature) | C3 |
| Suhu Operasi | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (Commercial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Jenis Ingatan | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |
| Status RoHS | — | Compliant |