EP3SE260F1152C4N vs EP3SE260F1152C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4N sa pamamagitan ng Intel at EP3SE260F1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4N EP3SE260F1152C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) —
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 40 nm
Core Voltage 1.1 V 0.9 V to 1.1 V
Maximum Operating Frequency 450 MHz —
Packhaging 1152-ball FC-FBGA (flip-chip) 1152-ball FCBGA (Flip-Chip BGA)
Speed Grade -4 (commercial temperature) C3
Temperature na Operasyon 0C to +85C (commercial, 'C' suffix) 0C to +85C (Commercial)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Uri ng Memory SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements — 255,000
Embedded Memory (bits) — 16,672,768
Logic Array Blocks (LABs) — 10,200
User I/Os — 744
Embedded 18x18 Multipliers — 384
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG
PLLs — 12
Tindminan RoHS — Compliant

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita