EP3SE260F1517C3N vs EP3SE260F1517C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C3N disebabkan oleh Intel dan EP3SE260F1517C2 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Bahagian terakhir untuk beliAltera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C3N | EP3SE260F1517C2 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | 12 |
| Global Clock Networks | 16 | — |
| Kemasan | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 |
| Suhu Hubungan Operasi | 0 C to +85 C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 254,400 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Total Memory Bits | — | 16,672,768 |
| Distributed RAM (Kb) | — | 4,608 |
| Embedded Block RAM (Kb) | — | 15,408 |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Pins | — | 976 |
| High-Speed Transceivers | — | 48 (up to 6.375 Gbps) |
| Temperature Grade | — | Commercial (0C to +85C, suffix C2) |
| Process Node | — | TSMC 40 nm |