EP3SE260F1517C3N vs EP3SE260F1517C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3N sa pamamagitan ng Intel at EP3SE260F1517C2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3N | EP3SE260F1517C2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | 12 |
| Global Clock Networks | 16 | — |
| Packhaging | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 |
| Temperature ng Junction na Operasyon | 0 C to +85 C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 254,400 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Total Memory Bits | — | 16,672,768 |
| Distributed RAM (Kb) | — | 4,608 |
| Embedded Block RAM (Kb) | — | 15,408 |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Pins | — | 976 |
| High-Speed Transceivers | — | 48 (up to 6.375 Gbps) |
| Temperature Grade | — | Commercial (0C to +85C, suffix C2) |
| Process Node | — | TSMC 40 nm |