EP3SE260H780C4LG vs EP3SE260H780C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4LG disebabkan oleh Altera dan EP3SE260H780C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C4LG | EP3SE260H780C2N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | Stratix III Enhanced (EP3SE) | — |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 101,760 | — |
| Embedded Memory (M9K + M144K) | 18.36 Mbits | — |
| DSP Blocks (18-bit x 18-bit) | 768 | — |
| 18-bit x 18-bit Multipliers | 1,536 | — |
| Transceivers (full-duplex) | 8 (up to 6.375 Gbps) | — |
| Maximum User I/O Pins | 488 | — |
| Kemasan | 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch) | 780-BGA FCBGA |
| Speed Grade | C4 (commercial, mid-speed tier) | C2 |
| Temperature Grade | Commercial (0C to +85C junction) | — |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Operating Voltage (Core) | 0.9 V / 1.0 V / 1.1 V (programmable) | — |
| External Memory Interface | Up to 800 Mbps DDR3, QDR II+, RLDRAM II | — |
| Hard IP Blocks | PCIe Gen2, 10GbE MAC, memory controllers | — |
| Status RoHS | Compliant (Pb-free HBGA) | [DATA_NEEDED: rohs status] |
| Aras MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Core Voltage | — | 0.9 V |
| Gambaran Suhu Operasi | — | Commercial (0C to +85C) |
| Reflow Peak Time Max | — | 40 s |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |