EP3SE260H780C4LG vs EP3SE260H780C2N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SE260H780C4LG tarafından Altera ve EP3SE260H780C2N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP3SE260H780C4LG | EP3SE260H780C2N |
|---|---|---|
| Marka | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Son Alış Zamanı |
| Family | Stratix III Enhanced (EP3SE) | — |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 101,760 | — |
| Embedded Memory (M9K + M144K) | 18.36 Mbits | — |
| DSP Blocks (18-bit x 18-bit) | 768 | — |
| 18-bit x 18-bit Multipliers | 1,536 | — |
| Transceivers (full-duplex) | 8 (up to 6.375 Gbps) | — |
| Maximum User I/O Pins | 488 | — |
| Paket | 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch) | 780-BGA FCBGA |
| Speed Grade | C4 (commercial, mid-speed tier) | C2 |
| Temperature Grade | Commercial (0C to +85C junction) | — |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Operating Voltage (Core) | 0.9 V / 1.0 V / 1.1 V (programmable) | — |
| External Memory Interface | Up to 800 Mbps DDR3, QDR II+, RLDRAM II | — |
| Hard IP Blocks | PCIe Gen2, 10GbE MAC, memory controllers | — |
| RoHS Durumu | Compliant (Pb-free HBGA) | [DATA_NEEDED: rohs status] |
| MSL Seviyesi | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Core Voltage | — | 0.9 V |
| İşletim Sıcaklığı Aralığı | — | Commercial (0C to +85C) |
| Reflow Peak Time Max | — | 40 s |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |