EP3SE260H780I4N vs EP3SE260H780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4N disebabkan oleh Intel dan EP3SE260H780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE260H780I4N | EP3SE260H780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III Enhanced (Stratix III E) | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10200 |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Kemasan | 780-pin FC-HFBGA (FCBGA) | 780-ball FCBGA (HBGA), flip-chip |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Suhu Operasi | -40C to +100C (Industrial) | Commercial, 0C to +85C |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Status RoHS | Compliant | Compliant (per product listings) |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Device Family | — | Stratix III Enhanced (Stratix III E) |
| Series | — | EP3SE |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Operating Voltage (Core) | — | 0.9 V |
| Operating Voltage (Auxiliary) | — | 1.1 V |
| Speed Grade | — | C3 |
| Maximum Core Frequency | — | 500 MHz |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Tingkat sensitiviti Air Nama (MSL) | — | 3 (168 hours) |
| Packaging Type | — | Tray |
| Configuration Memory Support | — | Fast passive parallel, JTAG, Active Serial |