EP3SE50F484C4L vs EP3SE50F484C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C4L disebabkan oleh Intel dan EP3SE50F484C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484C4L | EP3SE50F484C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits (M9K + M144K + MLAB) | — |
| Embedded Multipliers (18x18) | 384 | — |
| Maximum User I/Os | 296 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm low-power CMOS |
| Speed Grade | -4 (performance-oriented) | — |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Kemasan | 484-ball FC-FBGA | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Core Voltage (typical) | 0.9 V | — |
| PLLs | 12 | — |
| Lead-Free Finish | Yes (L suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 (168 hours) | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Device Logic Elements | — | 47,500 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| User I/Os | — | 296 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Tegangan Pemberi Arus | — | Core and I/O voltages per Stratix III E datasheet |
| Suhu Operasi | — | 0C to +85 C (commercial, C suffix) |
| Status RoHS | — | Lead-free (per DigiKey listing) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Status Lingkungan Hidup | — | Obsolete (per Worldway listing 2026-04-05) |