EP3SE50F484I4N vs EP3SE50F484I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I4N disebabkan oleh Intel dan EP3SE50F484I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484I4N | EP3SE50F484I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Device Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (TriMatrix) | 2,136 Kbits | — |
| Embedded Multipliers (18x18) | 384 | [DATA_NEEDED: number of 18x18 multipliers] |
| User I/Os | 296 | — |
| I/O Banks | 12 | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum User I/O Frequency | 800 MHz (per DigChip datasheet summary) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | — |
| Kemasan | 484-ball FC-FBGA (F484) | 484-pin FC-FBGA (flip-chip BGA) |
| Suhu Operasi | 0 C to +85 C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I4 | I3 (industrial, bin 3) |
| Lead-Free / RoHS | Lead-free (per ampheo listing) | Yes (N suffix) |
| Family | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Maximum User I/O | — | 296 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |