EP3SL200H780I3 vs EP3SL200H780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I3 disebabkan oleh Intel dan EP3SL200H780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780I3 | EP3SL200H780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Suhu Operasi | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Kemasan | 780-BBGA, FCBGA (HBGA-780) | 780-BBGA, FCBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |