EP3SL200H780I4N vs EP3SL200H780I4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I4N disebabkan oleh Intel dan EP3SL200H780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL200H780I4N EP3SL200H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Series Stratix III L —
Family Stratix III (Logic-rich variant) Stratix III L
Logic Elements 200,000 200,000
Logic Array Blocks (LABs) 8,000 8,000
Embedded Memory (bits) 10,901,504 —
User I/Os 488 —
Core Voltage 1.1 V (0.86 V to 1.15 V range) —
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz —
Speed Grade I4 I4 (Industrial)
Gambaran Suhu Operasi -40C to +100C (industrial) —
Kemasan 780-ball FCBGA (Flip-Chip BGA, FineLine) 780-pin FC-HFBGA (Flip-Chip)
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Lead-Free Yes (suffix N) —
Status RoHS Compliant Compliant
Embedded Memory (Bits) — 10,901,504
Maximum User I/O — 488
Core Supply Voltage — 0.86 V to 1.15 V
Internal Performance — 375 MHz
Suhu Operasi — -40C to +100C (Industrial)
Transceivers — Up to 24 channels
Transceiver Data Rate — Up to 6.375 Gbps
DSP Blocks — 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support — DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support — IEEE Std 1149.1 Boundary-Scan
HardCopy Support — Compatible (Lattice-style migration path via HardCopy III)

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