EP3SL200H780I4N vs EP3SL200H780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4N sa pamamagitan ng Intel at EP3SL200H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I4N | EP3SL200H780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III L | — |
| Family | Stratix III (Logic-rich variant) | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | 8,000 |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | — |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | I4 (Industrial) |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA, FineLine) | 780-pin FC-HFBGA (Flip-Chip) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory (Bits) | — | 10,901,504 |
| Maximum User I/O | — | 488 |
| Core Supply Voltage | — | 0.86 V to 1.15 V |
| Internal Performance | — | 375 MHz |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Transceivers | — | Up to 24 channels |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| DSP Blocks | — | 9x9 / 18x18 / 36x36 multipliers |
| Memory Interface Support | — | DDR3, DDR2, DDR, QDR II+, RLDRAM II |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan |
| HardCopy Support | — | Compatible (Lattice-style migration path via HardCopy III) |